Releases · renesas/fsp

EWARM support for RA4E2 and RA6E2 MCUs.
EWARM versions 9.20.x, 9.30.1 and 9.32.1 do not contain support for the RA4E2 and RA6E2. To develop for RA4E2 / RA6E2, It will be necessary to either:
- Update to EWARM v9.32.2 or
- Install support patch files which can be downloaded by EWARM v9.20/9.30/9.32.1 users from the MyPages system on www.iar.com

Features Added

Support for new RA4E2 and RA6E2 MCUs
- Includes support for the following development boards:
  - EK-RA4E2
  - EK-RA6E2
  - FPB-RA4E2
  - FPB-RA6E2
- Added TrustZone support
- Added ID Code support
Dialog DA14531 BLE module support
Support for Azure Cellular Embedded Wireless Framework (EWF) on RYZ024A
- Includes support for running in bare-metal applications
Support for Azure USBX DFU
Two new motor control functions ("Return origin" and "Inertia estimation")
Security features:
- AES XTS support on SCE5 and SCE5_B
- AES XTS and CTR support on SCE7
- Key Injection for AES 192 and ECC-Brainpool 256/384 curves on SCE9
Support for new part packages:
- 16-pin BGA package for RA2E2
- 64-pin BGA package for RA4M3 and RA6M4
- 144-pin BGA package for RA4M3, RA6M4 and RA6M5

Fixes and Improvements

SEGGER JLink updated to 7.84d
E2 and E2 Lite version updated to 1.11.4
Microsoft Azure components updated to v6.2.0
- Fixed GUIX image corruption in rotated display modes
Platform installer updated to include e2 studio 2023-01
CTSU:
- Improved moving average calculation
- Fixed linearity issue when scan time is increased (CTSU2 only)
Motor Control:
- Updated speed observer for position control
- Improved PWM output control
- Fixed issue when using a down-count timer for speed calculation
Improved floating point operations in HS300X support
Corrected TSN calibration data register address on RA6M5
Various configuration tool property and constraint fixes
AGT:
- Updated AGT driver to support AGT and AGTW at runtime
- AGT and AGTW peripheral IO-Define registers have been updated as follows
  - They now use the "R_AGTX" prefix instead of "R_AGT" or "R_AGTW"
  - Added 16-bit and 32-bit overlap registers
  - If using direct register access, update code to the new register mapping

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 2.1.0

Amazon coreMQTT: 1.2.0

Amazon corePKCS11: 3.4.0

Amazon FreeRTOS+FAT: d725a4c1

Amazon FreeRTOS Cellular Interface: 1.2.0

Amazon FreeRTOS Kernel: 10.4.6

Amazon FreeRTOS+TCP: 2.4.0

Arm CMSIS5: 5.9.0

Arm Mbed TLS: 3.2.1+renesas.0

Arm Trusted Firmware-M: 1.6.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.0

MCUboot: 1.9.0+renesas.0

Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.1+renesas.0

Microsoft Azure RTOS FileX: 6.2.0

Microsoft Azure RTOS GUIX: 6.2.0

Microsoft Azure RTOS LevelX: 6.2.0

Microsoft Azure RTOS NetX Duo: 6.2.0

Microsoft Azure RTOS ThreadX: 6.2.0

Microsoft Azure RTOS USBX: 6.2.0

SEGGER emWin: 6.30 (Includes AppWizard: V134_630)

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Known Issues

Visit GitHub Issues for this project.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

FSP_Packs_v4.3.0.zip 2de298cbdb0ed2ee58a50cfbca6274a9
FSP_Packs_v4.3.0.exe c9e4823e3c5ad1fac7bc46a6f93de540
fsp_documentation_v4.3.0.zip 8284da806d27b0d73118558def479ae5
setup_fsp_v4_3_0_e2s_v2023-01.exe b68d892697f8ad4f55b5d9ff2d71dc69
setup_fsp_v4_3_0_e2s_v2023-01.AppImage a870a52f2317535e8af2dab076ae3153
setup_fsp_v4_3_0_rasc_v2023-01.exe 80215914886842d00b883db834e72408
setup_fsp_v4_3_0_rasc_v2023-01.AppImage bf00b738d09e93ff4e894cb80392e97f
MDK_Device_Packs_v4.3.0.zip 7ea9af8270ac5c2a1fa9a82a7d2c6547

Assets 10

15 Dec 17:55

renesas-fsp-development

v4.2.0

046ca18

v4.2.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.2.0.

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_2_0_e2s_v2022-10.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_2_0_e2s_v2022-10.AppImage, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_2_0_rasc_v2022-10.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler: 10.3-2021.10

IAR Compiler: 9.20.2

ARM Compiler: 6.18

QE for Capacitive Touch: 3.1.0

QE for Display: 3.1.0

Renesas E2 and E2 Lite: 1.10.2

SEGGER J-Link: 7.82c

New Features

Dialog DA 16200 WiFi module support
USBX Host Video Class (HUVC) support
Security features:
- Plaintext key generation support for SCE7/SCE9
- Key Injection for RSA and ECC on SCE7/SCE9
- AES XTS support on SCE9
BLE Mesh Light LC Server updated to return detailed Events

Fixes and Improvements

CTSU:
- Improved handling of ADC for CTSU2 diagnostic operations
- Added new touch judgement algorithm
BLE:
- Fixed various issues
Fixed build warning when using the USB Bare-Metal Printer class with DMA
Fixed build issue with PWM Audio Playback module on MCUs with AGTW
Fixed secure project build issue with IAR compiler
Fixed infinite loop in FreeRTOS+TCP when FreeRTOS_IPInit() is called with unplugged Ethernet cable
Fixed incorrect description of the usb_instance_ctrl_t type in FSP documentation
Fixed linker memory map issues with OSPI
Added missing UCKSEL register setting for RA2A1
Corrected External Bus register mapping for RA6M5
SCE7 devices now support all ECC-384 operations including key generation, signing, verification and key derivation
SEGGER JLink updated to 7.82c
SEGGER emWin updated to 6.30

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 2.1.0

Amazon coreMQTT: 1.2.0

Amazon corePKCS11: 3.4.0

Amazon FreeRTOS+FAT: d725a4c1

Amazon FreeRTOS Cellular Interface: 1.2.0

Amazon FreeRTOS Kernel: 10.4.6

Amazon FreeRTOS+TCP: 2.4.0

Arm CMSIS5: 5.9.0

Arm Mbed TLS: 3.2.1+renesas.0

Arm Trusted Firmware-M: 1.6.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.0

MCUboot: 1.9.0+renesas.0

Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.1+renesas.0

Microsoft Azure RTOS FileX: 6.1.12

Microsoft Azure RTOS GUIX: 6.1.12

Microsoft Azure RTOS LevelX: 6.1.12

Microsoft Azure RTOS NetX Duo: 6.1.12

Microsoft Azure RTOS ThreadX: 6.1.12

Microsoft Azure RTOS USBX: 6.1.12

SEGGER emWin: 6.30

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Known Issues

Visit GitHub Issues for this project.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

FSP_Packs_v4.2.0.zip 41e8bcf190faee054fd3844a3ba018d1
FSP_Packs_v4.2.0.exe 8a67c8792c2f6bf337f55818633863ed
fsp_documentation_v4.2.0.zip b6fb9fc9aea43857bd311d7879f9f13c
setup_fsp_v4_2_0_e2s_v2022-10.exe 4b05453d2024114a6846f40e7c0c753b
setup_fsp_v4_2_0_e2s_v2022-10.AppImage 1ebf7099e2d2b62c3b577703e10b10d7
setup_fsp_v4_2_0_rasc_v2022-10.exe 56452459dc6e4df055c47047340617ee
setup_fsp_v4_2_0_rasc_v2022-10.AppImage 8a7b1af0d8afb39552e1c50725f479c7
MDK_Device_Packs_v4.2.0.zip 97b1b9cfd731474d2c78bbb63352169b

Assets 10

24 Oct 16:56

renesas-fsp-development

v4.1.0

c9de573

v4.1.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.1.0.

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_1_0_e2s_v2022-10.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_1_0_e2s_v2022-10.AppImage, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_1_0_rasc_v2022-10.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler: 10.3-2021.10

IAR Compiler: 9.20.2

ARM Compiler: 6.18

QE for Capacitive Touch: 3.1.0

QE for Display: 3.1.0

Renesas E2 and E2 Lite: 1.10.2

SEGGER J-Link: 7.80c

Features Added

AWS Cellular support for RYZ024A
RYZ014A API support for Azure Embedded Wireless Framework (EWF)
- NetX is supported through Azure EWF. Please see the usage notes for limitations and examples.
Added USB bare-metal Printer class
Mass Storage class support for USBX OTG
Added key injection support for SCE5, SCE5_B and SCE9
Updated Azure RTOS to 6.1.12
Updated Arm Mbed TLS to 3.2.1
Updated emWin to v6.28
Updated SEGGER JLink to 7.80c
Updated Renesas E2 and E2 Lite Emulator support files to V1.10.2

Fixes and Improvements

GPT TPCS bitfield width adjusted for some MCUs
Fixed issue with the AWS Core MQTT Silex WiFi implementation where a socket error was returned when no data is received before the receive timeout
Removed references to removed R_DOC_StatusGet function in TrustZone guard function generation
RM_MOTOR modules now generate the correct callback prototype
Fixed issue with ADC_B where the mode selection for converter 1 was configured incorrectly
Improved ease of use for BLE Mesh library network configuration
Fixed issue where the r_ble_balance library scan functions were returning an incorrect device address when compiled with AC6
Fixed issue with CTSU FuSa functions when closing and re-opening module
NetX can now change the Ethernet MAC address at runtime via nx_ip_interface_physical_address_set()
Fixed USB compile error on part families that provide USBHS when using a package that does not support it
Fixed issue with using more than one USB MSC device with USBX Hub Host

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 2.1.0

Amazon coreMQTT: 1.2.0

Amazon corePKCS11: 3.4.0

Amazon FreeRTOS+FAT: d725a4c1

Amazon FreeRTOS Cellular Interface: 1.2.0

Amazon FreeRTOS Kernel: 10.4.6

Amazon FreeRTOS+TCP: 2.4.0

Arm CMSIS5: 5.9.0

Arm Mbed TLS: 3.2.1+renesas.0

Arm Trusted Firmware-M: 1.6.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.0

MCUboot: 1.9.0+renesas.0

Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.1+renesas.0

Microsoft Azure RTOS FileX: 6.1.12

Microsoft Azure RTOS GUIX: 6.1.12

Microsoft Azure RTOS LevelX: 6.1.12

Microsoft Azure RTOS NetX Duo: 6.1.12

Microsoft Azure RTOS ThreadX: 6.1.12

Microsoft Azure RTOS USBX: 6.1.12

SEGGER emWin: 6.28

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Known Issues

Visit GitHub Issues for this project.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

FSP_Packs_v4.1.0.zip 922d828b7e49268ce10029d7e34f1990
FSP_Packs_v4.1.0.exe 3f8e4b8ae9ca9e4fe0232ba11cdf7b11
fsp_documentation_v4.1.0.zip 55f5de1167c6e4d419473d3968a15519
setup_fsp_v4_1_0_e2s_v2022-10.exe 3e97197740751ab0636eafeba439ec2b
setup_fsp_v4_1_0_e2s_v2022-10.AppImage 4d064f0cd017f73a05e7615c6f7b2630
setup_fsp_v4_1_0_rasc_v2022-10.exe c3ac7e2ab9cb963f371c69cba4727264
setup_fsp_v4_1_0_rasc_v2022-10.AppImage faa425886e2b0da6d9f134baccc4e5b8
MDK_Device_Packs_v4.1.0.zip fcd6e4baf26fdeecae5321f0186e2069

Assets 10

29 Aug 16:53

renesas-fsp-development

v4.0.0

9860fae

v4.0.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.0.0.

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_0_0_e2s_v2022-07.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_0_0_e2s_v2022-07.AppImage, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_0_0_rasc_v2022-07.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler: 10.3-2021.10

IAR Compiler: 9.20.2

ARM Compiler: 6.18

QE for Capacitive Touch: 3.1.0

QE for Display: 3.0.0

Renesas E2 and E2 Lite: 1.9.8

SEGGER J-Link: 7.68b

Features Added

Added unique iodefine files for each MCU type
Added DMAC support for r_spi
Added ADC_B support for 16-bit precision
Added new SCE5 procedures
Added new sensor ZMOD4450
Added SCE7 Key Injection
Added support for OTG HID on USBX
Added USBX HUB
MbedTLS updated to v3.1.0
MCUboot updated to v1.9.0
Arm Trusted Firmware-M updated to v1.6.0
Added Migration guide for 4.0 FreeRTOS updates
Added drivers for SCE5_B to support hardware acceleration for crypto operations
Updated FreeRTOS
- Secure sockets has been removed. There is no direct replacement.
  - Cellular and FreeRTOS+TCP still have basic socket APIs (no TLS). WiFi has no "public" socket APIs any longer.
- AWS MQTT/HTTP Client modules which were marked as deprecated have been completely removed.
- CoreMQTT and CoreHTTP are still supported. These modules now use the same transport interface that cellular uses for WiFi and TCP as well. There are sockets wrappers for FreeRTOS+TCP, WiFi, and Cellular that tie in to this transport interface.
  - When upgrading existing user projects CoreMQTT/HTTP modules on the stack will show as (Deprecated). The user should go into new stack and add new CoreMQTT/HTTP stacks and then migrate settings from the old ones. This will be described in greater detail in a project migration guide.
- C_SDK and IoT modules are no longer supported. These modules remain in FSP packs for backwards compatibility but they will not compile and no longer bring in source files.
  - In e2 studio these modules will show as (No Longer Supported) with a permanent constraint error and the module info link in the stack will point to a migration guide.
- The MbedTLS/PKCS11 transport interface only supports secure TLS TCP connections over IPV4. IPV6 is not supported. UDP is not supported. Unsecure/non-TLS is not supported.
- As mentioned above WiFi doesn't expose a fully featured sockets API any longer. Customers can potentially use the transport interface or sockets wrapper directly if they need standalone sockets. This comes with the same limitations as mentioned above (only IPv4/TCP sockets).
  - This means there is no way to create a UDP socket with WiFi using an AWS offering.
- The deprecated module AWS PKCS11 PAL (rm_aws_pkcs11_pal) has been removed. Any customer still using this will need to start using AWS PKCS11 PAL on LittleFS (rm_aws_pkcs11_pal_littlefs) instead.
- Dev Assist and examples for CoreMQTT/HTTP have been updated to reflect any changes. Please see these for appropriate code changes.
Secure User-key installation support added via the new SCE Key Installation module

Improvements

Changed mutual capacitance calculation from unsigned to signed to measure very small mutual capacitance
Improved ultra-low power support for ZMOD4510 OAQ 2nd Gen sensor
Added additional usage note documentation for using the rm_ob1203 module with multiple operation modes on a single OB1203 sensor device
Improved HS400X usage notes for using the Hold Measurement function
Modified RM_COMMS_I2C configuration to use a semaphore and a mutex for I2C shared bus by default when an RTOS is available
Integrate sensorless and encoder callback definitions for motor modules into API definitions
Timers for BLE MESH are now reusable to reduce OS timer consumption
Added semaphore-based interrupt synchronization for the BLE library to improve performance when using FreeRTOS
Change Ethernet Phy LSI configuration to support multiple Phy LSIs

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 2.1.0

Amazon coreMQTT: 1.2.0

Amazon corePKCS11: 3.4.0

Amazon FreeRTOS+FAT: d725a4c1

Amazon FreeRTOS Cellular Interface: 1.2.0

Amazon FreeRTOS Kernel: 10.4.6

Amazon FreeRTOS+TCP: 2.4.0

Arm CMSIS5: 5.9.0

Arm Mbed TLS: 3.1.0+renesas.0

Arm Trusted Firmware-M: 1.6.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.0

MCUboot: 1.9.0+renesas.0

Microsoft Azure RTOS FileX: 6.1.11

Microsoft Azure RTOS GUIX: 6.1.11

Microsoft Azure RTOS LevelX: 6.1.11

Microsoft Azure RTOS NetX Duo: 6.1.11

Microsoft Azure RTOS ThreadX: 6.1.11

Microsoft Azure RTOS USBX: 6.1.11

SEGGER emWin: 6.26d

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Known Issues

Visit GitHub Issues for this project.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

FSP_Packs_v4.0.0.zip 7520030fa2ef760bc34ed3a748ffb428
FSP_Packs_v4.0.0.exe f95f38c5454b09a1fc7c9a3251d59162
fsp_documentation_v4.0.0.zip 26a2ebbbd0d9279ee8c930ba72bdeae8
setup_fsp_v4_0_0_e2s_v2022-07.exe 8e74a2fba18a24a374f03647c0534c37
setup_fsp_v4_0_0_e2s_v2022-07.AppImage e4ccbaa9c156f302bc383944f2d0c289
setup_fsp_v4_0_0_rasc_v2022-07.exe 4bda9f930ee4b0d313590383d895ad24
setup_fsp_v4_0_0_rasc_v2022-07.AppImage 5e96347e8cc357fce43aef0d337e8ec3
MDK_Device_Packs_v4.0.0.zip 3b66a968b4f3b9b49e4b17eb2952f2a4

Assets 10

29 Jun 23:42

JGrenard

v3.8.0

52e8afd

v3.8.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.8.0.

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v3_8_0_e2s_v2022-04.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v3_8_0_e2s_v2022-04.AppImage, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v3_8_0_rasc_v2022-04.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler: 10.3-2021.10

IAR Compiler: 9.20.2

ARM Compiler: 6.18

QE for Capacitive Touch: 3.1.0

QE for Display: 3.0.0

Renesas E2 and E2 Lite: 1.8.0

SEGGER J-Link: 7.64e

Features Added

Added RYZ OTA
Added I2S Slave support
Updated to Azure RTOS 6.1.11
Updated emWin to v6.26c
Added MCUboot encryption support
Added FS1015, FS3000, HS400x sensor interface
Added USBX host printer support
Updated CMSIS to 5.9.0
Added CTSU offset tuning function
Added motor hall FOC module
Added motor inductive sensor FOC module

Improvements

Added SCE9 Dev Assist
Adjusted the timing of R_BLE_Open API to stabilize the operation at the time of initialization
Improved R_BLE response performance when applied connection latency feature
Fixed R_BLE_GAP_UpdConn parameter check
Improved I2C Slave reserved address parameter checking

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 2.0.0

Amazon coreMQTT: 1.1.0

Amazon FreeRTOS+FAT: d725a4c1

Amazon FreeRTOS: 202012.00

Amazon FreeRTOS Cellular Interface: 1.2.0

Amazon FreeRTOS Kernel: 10.4.3-LTS-Patch-2

Amazon FreeRTOS+TCP: 2.3.2-LTS-Patch-2

Arm CMSIS5: 5.9.0

Arm Mbed TLS: 2.25.0+renesas.0

Arm Trusted Firmware-M: 1.3.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.0

MCUboot: 1.8.0+renesas.1

Microsoft Azure RTOS FileX: 6.1.11

Microsoft Azure RTOS GUIX: 6.1.11

Microsoft Azure RTOS LevelX: 6.1.11

Microsoft Azure RTOS NetX Duo: 6.1.11

Microsoft Azure RTOS ThreadX: 6.1.11

Microsoft Azure RTOS USBX: 6.1.11

SEGGER emWin: 6.26c

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Known Issues

Visit GitHub Issues for this project.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

FSP_Packs_v3.8.0.zip aaba68b567d2c53081675145444604ba
FSP_Packs_v3.8.0.exe ad69d1f34e1189b0128b8003afb453dd
fsp_documentation_v3.8.0.zip ebd5297441ddf3722cadd2a6c997d013
MDK_Device_Packs_v3.8.0.zip f8006f46bf6490e25ea68b1aed0ba278
setup_fsp_v3_8_0_e2s_v2022-04.AppImage ff682ca6ae33682664457cc0877769fe
setup_fsp_v3_8_0_e2s_v2022-04.exe 34356d336d81ee41f40cd528955f6ade
setup_fsp_v3_8_0_rasc_v2022-04.AppImage e6e324be372cbf0d6296a6991f87f9de9b0f3efb
setup_fsp_v3_8_0_rasc_v2022-04.exe 4f7c0d80975b6969a7bea50c0de151fe09d09f35

Assets 10

23 May 14:47

renesas-fsp-development

v3.7.1

b58ec0d

v3.7.1

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.7.1.

This release includes packs that are installed separately from e2 studio. This means the v3.7.0 platform installer (Windows) or the v3.7.0 AppImage (Linux) should be installed first. Then the packs for this release can be installed into the new e2 studio.

The packs, and a standalone pack installer, are available in the Assets section of this release.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Bug Fixes

See fixed GitHub Issues for this release.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

FSP_Packs_v3.7.1.zip c4bb7ad5f3fdd7624bd4f62a922e6dac
FSP_Packs_v3.7.1.exe 3ddfd519f80690f4770279ff9044a973
fsp_documentation_v3.7.1.zip 7fec141d1d529a4f628d6fafcabbe47a

Assets 5

26 Apr 17:00

renesas-fsp-development

v3.7.0

a44c4cf

v3.7.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.7.0.

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v3_7_0_e2s_v2022-04.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v3_7_0_e2s_v2022-04.AppImage, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v3_7_0_rasc_v2022-04.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler: 10.3-2021.10

IAR Compiler: 9.20.2

ARM Compiler: 6.17

QE for Capacitive Touch: 3.0.2

QE for Display: 3.0.0

Renesas E2 and E2 Lite: 1.8.0

SEGGER J-Link: 7.62b

Features Added

Added CK-RA6M5 board support.
Added FPB-RA2E2 board support.
Added OB1203 light/proximity/PPG sensor support.
Added ICS1894 low-power ethernet PHY support.
Added support for GPT PWM synchronized one-shot mode.
Added USB composite device (PHID+PHID) support.
Added MCUBoot protected mode RSA support.
Added RYZ012 SPI support.
Added USBX 6.1.10 support.
Added USBX peripheral printer class.
Added BLE Mesh provision related API.
Added OB1203 sensor RTOS support.
Updated I3C driver error recovery processing.

Improvements

Improved BLE Mesh configuration tool and developer assistance.
Improved documentation regarding error resolution for TrustZone guard functions.
Improved FSP Configuration tool for several MCUs to show pins in properties view.

Migrating to version 3.7.0:

Existing projects that utilize the RYZ012 middleware stack component must select a “Transport Interface” in the Configuration Editor after upgrading to FSP Version 3.7.0.

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 2.0.0

Amazon coreMQTT: 1.1.0

Amazon FreeRTOS+FAT: d725a4c1

Amazon FreeRTOS: 202012.00

Amazon FreeRTOS Cellular Interface: 1.2.0

Amazon FreeRTOS Kernel: 10.4.3-LTS-Patch-2

Amazon FreeRTOS+TCP: 2.3.2-LTS-Patch-1

Arm CMSIS5: 5.8.0

Arm Mbed TLS: 2.25.0+renesas.0

Arm Trusted Firmware-M: 1.3.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.0

MCUboot: 1.8.0+renesas.0

Microsoft Azure RTOS FileX: 6.1.10

Microsoft Azure RTOS GUIX: 6.1.10

Microsoft Azure RTOS LevelX: 6.1.10

Microsoft Azure RTOS NetX Duo: 6.1.10

Microsoft Azure RTOS ThreadX: 6.1.10

Microsoft Azure RTOS USBX: 6.1.10

SEGGER emWin: 6.24

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Known Issues

Visit GitHub Issues for this project.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

FSP_Packs_v3.7.0.zip a37092714567970a297555a3a2bb483d
FSP_Packs_v3.7.0.exe 06aed7db3f1bdb543561127cb2a1b433
fsp_documentation_v3.7.0.zip 8aa682ed2417c92f445d3ca98cfe5c0b
setup_fsp_v3_7_0_e2s_v2022-04.exe 5012bbf4f95b70ea8b93035569bf3836
setup_fsp_v3_7_0_e2s_v2022-04.AppImage e7891864f51b5f00eff4e882e434233d
setup_fsp_v3_7_0_rasc_v2022-04.exe 5656e06eb9057df519e0f45fd7ddc903
setup_fsp_v3_7_0_rasc_v2022-04.AppImage 87e2e7784e6b7952b2a656d692bfb5d3
MDK_Device_Packs_v3.7.0.zip 3607cdab62d9b74f0f606d20f62e30ba

Assets 10

25 Feb 17:40

renesas-fsp-development

v3.6.0

8dc1470

v3.6.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.6.0.

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v3_6_0_e2s_v2022-01.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v3_6_0_e2s_v2022-01.AppImage, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v3_6_0_rasc_v2022-01.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler: 10.3-2021.10

IAR Compiler: 9.20.2

ARM Compiler: 6.17

QE for Capacitive Touch: 3.0.1

QE for Display: 3.0.0

Renesas E2 and E2 Lite: 1.8.0

SEGGER J-Link: 7.60e

Features Added

Added BLE Mesh support.
Added RS-485 half duplex driver support with external transceiver.
Added support for 2nd generation Ultra Low Power (ULP) ZMOD4xxxx Indoor Air Quality (IAQ) sensors.
Added Cryptographic Algorithm Validation Program (CAVP) certified SCE Protected Mode module for MCUs that have SCE9.
Added IIR Filter Accelerator (r_iirfa).
Added XIP mode support in MCUboot.
Added UDP support to Silex WiFi module.
Added USBX OTG support.
Added RFC3394 for AES 128-bit and 256-bit keys to r_sce (Protected Mode).
Added AzureRTOS support to r_ble.
Added MCUboot dual bank support.
Added support for FreeRTOS Cellular Interface with a port for RYZ014A LTE Cat-M1 module.

Improvements

Added parameter checking to GLCDC gain tables.
Improved documentation for R_SCI_UART_BaudCalculate.
Improved FSP Configuration tool for USB and NetX DHCP.

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 2.0.0

Amazon coreMQTT: 1.1.0

Amazon FreeRTOS+FAT: d725a4c1

Amazon FreeRTOS: 202012.00

Amazon FreeRTOS Cellular Interface: 1.2.0

Amazon FreeRTOS Kernel: 10.4.3-LTS-Patch-2

Amazon FreeRTOS+TCP: 2.3.2-LTS-Patch-1

Arm CMSIS5: 5.8.0

Arm Mbed TLS: 2.25.0+renesas.0

Arm Trusted Firmware-M: 1.3.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.0

MCUboot: 1.8.0+renesas.0

Microsoft Azure RTOS FileX: 6.1.10

Microsoft Azure RTOS GUIX: 6.1.10

Microsoft Azure RTOS LevelX: 6.1.10

Microsoft Azure RTOS NetX Duo: 6.1.10

Microsoft Azure RTOS ThreadX: 6.1.10

Microsoft Azure RTOS USBX: 6.1.9

SEGGER emWin: 6.24

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Known Issues

Visit GitHub Issues for this project.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

FSP_Packs_v3.6.0.zip 7be3d75239068e3f7b6cd13ab3b9891e
FSP_Packs_v3.6.0.exe 731c9c02ab24789ee66a7221bdb3a7e8
fsp_documentation_v3.6.0.zip 66c4abed84be8a03ba0b0eace166dfb5
setup_fsp_v3_6_0_e2s_v2022-01.exe 9b0d6047fa0050c1b8c4144bbbd9e2a9
setup_fsp_v3_6_0_e2s_v2022-01.AppImage fa569e383e683319e5616145b8d70f09
setup_fsp_v3_6_0_rasc_v2022-01.exe 49a2bc1ed1cf96072aad5b0dabb9f582
MDK_Device_Packs_v3.6.0.zip 0919ce5bca0f30e659881ad2e264bd6a

Assets 9

08 Dec 18:00

renesas-fsp-development

v3.5.0

a1fedf1

v3.5.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 3.5.0.

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v3_5_0_e2s_v2021-10.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v3_5_0_e2s_v2021-10.AppImage, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v3_5_0_rasc_v2021-10.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler: 10.3-2021.10

IAR Compiler: 9.20.2

ARM Compiler: 6.17

QE for Capacitive Touch: 2.0.0

QE for BLE: 1.3.0

e2 studio: 2021-10

RASC: 2021-10

Renesas E2 and E2 Lite: 1.6.12

SEGGER J-Link: 7.56b

Features Added

RA6T2 MCU support added.
MCK-RA6T2 board support added.
Trigonometric Function Unit (TFU) support added to accelerate calculation of sinf, cosf, atan2f, and hypotf on RA6T2.
Motor 120-degree conduction control with Hall sensors support added (rm_motor_120_control_hall).
Motor 120-degree conduction control sensorless support added (rm_motor_120_control_sensorless).
Motor ADC and PWM modulation driver support added (rm_motor_120_driver).
Motor control middleware updated for RA6T2.
QSPI support added to MCUboot port (rm_mcuboot_port).
PWM Delay Generation support added to GPT (r_gpt).
OctaRAM support added to OSPI (r_ospi).
SPI support added for SPI_B peripheral on RA6T2 (r_spi_b).
SPI support added for SCI_B peripheral on RA6T2 (r_sci_b_spi).
UART support added for SCI_B peripheral on RA6T2 (r_sci_b_uart).
I2C master support added for SCI_B peripheral on RA6T2 (r_sci_b_i2c).
I2C master support added for IIC_B peripheral on RA6T2 and RA2E2 (r_iic_b_master).
I2C slave support added for IIC_B peripheral on RA6T2 and RA2E2 (r_iic_b_slave).
ADC support added for ADC_B peripheral on RA6T2 (r_adc_b).
New Stack tree reorganized in the RA Configuration editor.
CTSU UART tuning feature support added.
SCE9 TLS 1.2 support added.
Support for multiple ZMOD sensor modules added.