Release v4.2.0 · renesas/fsp

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.2.0.

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_2_0_e2s_v2022-10.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_2_0_e2s_v2022-10.AppImage, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_2_0_rasc_v2022-10.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Dialog DA 16200 WiFi module support
USBX Host Video Class (HUVC) support
Security features:
- Plaintext key generation support for SCE7/SCE9
- Key Injection for RSA and ECC on SCE7/SCE9
- AES XTS support on SCE9
BLE Mesh Light LC Server updated to return detailed Events

CTSU:
- Improved handling of ADC for CTSU2 diagnostic operations
- Added new touch judgement algorithm
BLE:
- Fixed various issues
Fixed build warning when using the USB Bare-Metal Printer class with DMA
Fixed build issue with PWM Audio Playback module on MCUs with AGTW
Fixed secure project build issue with IAR compiler
Fixed infinite loop in FreeRTOS+TCP when FreeRTOS_IPInit() is called with unplugged Ethernet cable
Fixed incorrect description of the usb_instance_ctrl_t type in FSP documentation
Fixed linker memory map issues with OSPI
Added missing UCKSEL register setting for RA2A1
Corrected External Bus register mapping for RA6M5
SCE7 devices now support all ECC-384 operations including key generation, signing, verification and key derivation
SEGGER JLink updated to 7.82c
SEGGER emWin updated to 6.30