Release v5.3.0 · renesas/fsp

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.3.0.

Minimum e2 studio version for FSP 5.3.0 is e2 studio 2024-04

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_3_0_e2s_v2024-04.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v5_3_0_e2s_v2024-04.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v5_3_0_e2s_v2024-04.pkg, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release,
setup_fsp_v5_3_0_rasc_v2024-04.exe, for Windows from here.
setup_fsp_v5_3_0_rasc_v2024-04.AppImage, for Linux from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

Arm GNU Toolchain: 13.2

LLVM Embedded Toolchain for Arm: 17.0.1

IAR Compiler: 9.50.2

ARM Compiler: 6.21

QE for Capacitive Touch: 3.3.0 or higher

QE for Display: 3.2.0

Renesas E2 and E2 Lite: 2.1.3

SEGGER J-Link: 7.96a

Change to FSP License

The FSP license has been changed to BSD-3-Clause, allowing for more flexible use in open-source projects. License terms (including exceptions) are available in the LICENSE file.

Important Information for RA0E1 Development

FSP v5.3.0 includes support for the new RA0E1 MCU. For developers using this MCU, please note the following important improvements and known issues:

Improvements

The space between the vector table (starting at 0x0) and option setting memory (starting at 0x400) is now automatically filled with a preselected set of BSP functions. This functionality can be changed via the new 'Fill flash gap' BSP property.
The functions placed in the section have been selected based on -Oz (aggressive size) optimization. When using other optimization levels this function may need to be disabled.
When disabled, the space can be filled with user code/data by placing items in the .flash_gap section.
The FSP development team is currently analyzing all RA0E1 drivers to identify additional areas where code size savings can be made. Significant optimizations will continue to be made in coming releases. Modules optimized so far include:
- ADC_D
- RTC_C
- SAU I2C
- SAU UART
- TAU

Known Issues

RA0E1 e2 studio projects currently automatically reset compiler optimization to -Oz (aggressive size optimization) when generating or compiling. To override this behavior, manually add the desired optimization flag(s) (e.g. -O0) to the 'Other optimization flags' box in the project Properties.
The following sensors are currently not supported:
- HS400x
- ZMOD4xxx
- OB1203
The following sensors do not support SAU-I2C driver:
- FS1015
- FS3000

Features

Support new development kits
- AIK-RA6M3
- AIK-RA4E1
- BGK-RA6E2
The following modules are now supported in RA0E1 projects:
- LPM
- IICA
- TML32
Support 4096-bit RSA key generation for RA8 devices
Support MCUBoot TrustZone for external QSPI based memory
Support HOCOCR2 register for RA4M1
Support GPT trigger for ADC
Added Netxduo wifi and onchip_silex_wifi documentation
Baremetal support for DA16XXX Wi-Fi and on-chip MQTT/HTTP client modules
Support for Reality AI over USB
Dual motor support for MCK-RA8T1
Support RRH46410 sensor
Support USBX composite PCDC+PMSC
DTC event selection now limited to only DTC-compatible events with an enabled interrupt
Support IICA for 20 and 16 pin devices of RA0E1

Fixes and Improvements

Platform installer updated to include e2 studio 2024-04
Segger J-Link version updated to 7.96a
IAR compiler version updated to 9.50.2
Common FSP API support updated to v1.5.0
Support RSIP-E51A protected mode for RA8D1 and RA8T1 devices
RSIP-E51A protected mode support new cryptographic feature.
- SHA-512
- ECC P-521
- RSA 3072/4096 bit key generation
- AES key wrap/unwrap following RFC3394
- Injected key import API
Support IICA Master in rm_comms_i2c
Updated GPT driver to support compare match
Updated documentation for USB
Updated documentation for Reality AI over USB
Updated MCUBoot documentation to address a TrustZone issue on RA8M1
Fixed some artifacting issues when using D-Cache in emWin projects
Fixed DOTF configuration key type
Fixed compilation failure when selecting 'use own target' for Ethernet PHY leads
Fixed limitation of LLVM support on BLE Mesh
Fixed limitation related to the restart of SAU-I2C driver
Fixed OSPI clock divider options for RA8D1
Fixed ADCR register for RA0E1
Fixed ADC conversion with synchronous trigger
Resolved USB event handling issue when connected to Android/Linux hosts
Fixed constraint issue with MCUBoot VTOR offset
Fixed MCUBoot dual bank mode on RA8M1
RTC on RA0E1 no longer pauses during Open if already running
Fixed a parameter checking issue in R_LVD_Open on RA8M1, RA8D1 and RA8T1 devices
Fixed issue when using UARTA with SOSC as the clock source
Improved rtc_alarm_time_t configuration for RTC_C to match other RTC implementations
Wi-Fi API header file (rm_wifi_api.h) was updated to support baremetal and not be dependent on FreeRTOS
- portmacro and rm_wifi_config header files were wrapped to check for FreeRTOS
- Wi-Fi configuration macros were included and wrapped to check for baremetal
- WIFI_IsConnected() function return type was changed from BaseType_t to WIFI_ReturnCode_t to remove FreeRTOS dependency
  - Users will need to change their return value check (success return value changed from 1 to 0)

Known Issues

Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
PMSC may not work properly when USBX Composite Device(PCDC+PMSC) is connected to specific Linux OS (USB Host).

Visit GitHub Issues for this project.