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@renesas-fsp-development renesas-fsp-development released this 27 Jan 01:09
· 52 commits to master since this release
v2.3.0
aaf76e4

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 2.3.0.

Download the FSP with e2 studio Installer for this release, setup_fsp_v2_3_0_e2s_v2021-01.exe, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v2_3_0_rasc_v2021-01.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler : 9-2019-q4-major

IAR Compiler: 8.50.7

ARM Compiler : 6.14

QE for Capacitive Touch : 1.2.0

QE for BLE : 1.1.0

e2 studio: 2021-01

RASC: 2021-01

Features Added

  • RA2E1 MCU support added.
  • EK-RA2E1 Board support added.
  • RA4M2 MCU support added.
  • EK-RA4M2 Board support added.
  • Added support to use HW acceleration for CMAC and AES CCM (128, 192 and 256bit keys) on RA6M4, RA4M3, and RA4M2 MCUs.
  • Added support to use HW acceleration for HMAC (SHA224 and SHA256) on RA6M4, RA4M3, and RA4M2 MCUs.
  • Added support to utilize Crypto HW acceleration for AES-GCM and GHASH to process the initialization vector on RA6M4, RA4M3, and RA4M2 MCUs.
  • C-Cache is now enabled by default for RA4M2, RA4M3 and RA6M4 MCUs.
  • Developer assistance now works for non-secure callable modules in a non-secure project.
  • The r_ether driver now supports configuring padding bytes in receive buffers.
  • CM33 devices no longer allocate space for ROM registers between the vector table and 0x500. This space was unused since the new parts do not have ROM registers at 0x400.
  • Added support for Internal Clock Supply Architecture Type B for RA2L1 and RA2E1 MCUs.
  • Blinky templates are no longer shown when creating projects and choosing Custom User Board. These projects would not build because no LEDs were defined.

Third Party Software

These third party software solutions are included alongside FSP.

FreeRTOS: 202007.00

Arm CMSIS5: 5.7.0

Arm Mbed Crypto: 3.1.0+renesas.2

Arm Mbed TLS: 3.0.0p1

Arm Trusted Firmware-M: 1.1.0+renesas.1

Arm littlefs: 2.2.1+renesas.1

FreeRTOS+FAT: 160919a

Renesas E2 and E2 Lite: 1.5.3+20201217

SEGGER emWin: 6.14g

SEGGER J-Link: 6.94

TES D/AVE 2D: 3.8.0

Bug Fixes

A critical bug was found related to internal flash operation on prior FSP v2.x releases that may impact existing projects. Information about this issue can be found here. This bug has been fixed in this release.

See fixed GitHub Issues for this release.

Known Issues

Visit GitHub Issues for this project.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

  • FSP_Packs_v2.3.0.zip 28d080fb253d3184174532d931d28213
  • FSP_Packs_v2.3.0.exe 5c137c53ab8189086747a86661e8eff8
  • fsp_documentation_v2.3.0.zip cf408d04c3647d36431bf1fe5e66bc18
  • setup_fsp_v2_3_0_e2s_v2021-01.exe 77bf1c61cde4803535d8f7309c4ac4c5
  • setup_fsp_v2_3_0_rasc_v2021-01.exe 320963d110cea15f1454c4376cd94f04
  • MDK_Device_Packs_v2.3.0.zip e37f2698e8a2dff791aad34a16b20d9a
Assets 8
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