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Team
The Autodesk team is based out of the 3D Printing group in the Autodesk Consumer Group (ACG). We are working closely with Design and Fabrication group in Autodesk Research and the 123D Circuits team.
Karl D.D. Willis, Project Lead, San Francisco, CA Managing the overall project and collaboration with Harvard. Responsible for overall user experience and project scope.
Daniel Taub, Software Lead, Cambridge, MA Full time software engineer/visiting scientist co-located on Harvard campus. Responsible for the overall software system architecture, design, and implementation. In particular client-server protocols, integration with 123D Circuits, and hardware-software interface/printer integration/testing.
Baoxuan Xu, Geometry Lead, Toronto, Canada Software engineer specializing in graphics and geometry. Responsible for all 3D/geometry aspects of the project such as modeling operations, 3D wiring/routing, and slicing/print processing.
Tim Campbell, Use Case Lead, San Francisco, CA Researching target use cases in the Maker community. Designing custom electro-mechanical components and devices.
Ryan Schmidt, Technical Mentor, Toronto, Canada Contributing technical expertise in graphics, geometry, and 3D design tools.
Karl Bruneel, Technical Mentor, San Francisco, CA Contributing technical expertise in design tools for electronics.
Eric J. Wilhelm, Mentor, San Francisco, CA Contributing to the overall project direction.
The Voxel8 Team spun out of the Lewis Research Group at the Wyss Institute for Biologically Inspired Engineering, Harvard University. They bring significant experience and technical expertise in materials and hardware for 3D printing.
Jennifer A. Lewis, CEO
Michael Bell, Hardware Lead
Travis Busbee, Materials Lead
Jack Minardi, Software Lead
Daniel Oliver, Business Development Lead
User Scenarios contribute here to help explain how people will use Wire