2nd attempt

H3wastooshort · May 23, 2024 · 1cde6c3 · 1cde6c3
1 parent cc0a2f4
commit 1cde6c3
Showing 1 changed file with 4 additions and 4 deletions.
diff --git a/hardware/the_extender.kicad_pcb b/hardware/the_extender.kicad_pcb
@@ -43,15 +43,15 @@
     (stackup
       (layer "F.SilkS" (type "Top Silk Screen") (color "White"))
       (layer "F.Paste" (type "Top Solder Paste"))
-      (layer "F.Mask" (type "Top Solder Mask") (color "Purple") (thickness 0.01))
+      (layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.01))
       (layer "F.Cu" (type "copper") (thickness 0.035))
-      (layer "dielectric 1" (type "prepreg") (color "FR4 natural") (thickness 0.2014) (material "7628") (epsilon_r 4.4) (loss_tangent 0))
+      (layer "dielectric 1" (type "prepreg") (thickness 0.2014) (material "7628") (epsilon_r 4.4) (loss_tangent 0))
       (layer "In1.Cu" (type "copper") (thickness 0.0152))
       (layer "dielectric 2" (type "core") (color "FR4 natural") (thickness 1.065) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
       (layer "In2.Cu" (type "copper") (thickness 0.0152))
-      (layer "dielectric 3" (type "prepreg") (color "FR4 natural") (thickness 0.2104) (material "7628") (epsilon_r 4.4) (loss_tangent 0))
+      (layer "dielectric 3" (type "prepreg") (thickness 0.2104) (material "7628") (epsilon_r 4.4) (loss_tangent 0))
       (layer "B.Cu" (type "copper") (thickness 0.035))
-      (layer "B.Mask" (type "Bottom Solder Mask") (color "Purple") (thickness 0.01))
+      (layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.01))
       (layer "B.Paste" (type "Bottom Solder Paste"))
       (layer "B.SilkS" (type "Bottom Silk Screen") (color "White"))
       (copper_finish "HAL SnPb")