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VIC20_EXPANSION.kicad_mod
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VIC20_EXPANSION.kicad_mod
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(footprint "VIC20_EXPANSION" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 0)
(attr through_hole)
(fp_text reference "J1" (at -44 -12) (layer "F.SilkS")
(effects (font (size 1.2065 1.2065) (thickness 0.09652)) (justify left bottom))
(tstamp 00000000-0000-0000-0000-000000000000)
)
(fp_text value "VIC20_EXPANSIONPORT" (at 0 0) (layer "F.SilkS") hide
(effects (font (size 1.27 1.27) (thickness 0.15)))
(tstamp 00000000-0000-0000-0000-000000000000)
)
(fp_text user "A" (at 44.12 -10) (layer "B.SilkS")
(effects (font (size 1.2065 1.2065) (thickness 0.1016)) (justify left bottom mirror))
(tstamp 00000000-0000-0000-0000-000000000000)
)
(fp_text user "Z" (at -43.12 -10) (layer "B.SilkS")
(effects (font (size 1.2065 1.2065) (thickness 0.1016)) (justify left bottom mirror))
(tstamp 00000000-0000-0000-0000-000000000000)
)
(fp_text user "1" (at 43.12 -10) (layer "F.SilkS")
(effects (font (size 1.2065 1.2065) (thickness 0.1016)) (justify left bottom))
(tstamp 00000000-0000-0000-0000-000000000000)
)
(fp_text user "22" (at -44.12 -10) (layer "F.SilkS")
(effects (font (size 1.2065 1.2065) (thickness 0.1016)) (justify left bottom))
(tstamp 00000000-0000-0000-0000-000000000000)
)
(fp_poly (pts
(xy -45 0)
(xy 45 0)
(xy 45 -9)
(xy -45 -9)
) (layer "B.Mask") (width 0) (fill solid) (tstamp 00000000-0000-0000-0000-000000000000))
(fp_poly (pts
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(xy 45 0)
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(xy -45 -9)
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(fp_line (start -45 -1) (end -45 -10) (layer "Edge.Cuts") (width 0.05) (tstamp 00000000-0000-0000-0000-000000000000))
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(fp_line (start 44 0) (end 45 -1) (layer "Edge.Cuts") (width 0.05) (tstamp 00000000-0000-0000-0000-000000000000))
(fp_line (start 45 -1) (end 45 -10) (layer "Edge.Cuts") (width 0.05) (tstamp 00000000-0000-0000-0000-000000000000))
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(fp_line (start -46 -11) (end -51 -11) (layer "Edge.Cuts") (width 0.05) (tstamp 00000000-0000-0000-0000-000000000000))
(fp_arc (start 45 -10) (mid 45.292893 -10.707107) (end 46 -11) (layer "Edge.Cuts") (width 0.05) (tstamp 00000000-0000-0000-0000-000000000000))
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(pad "1" smd rect (at 41.58 -4.5) (size 2.2 9) (layers "F.Cu" "F.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "2" smd rect (at 37.62 -4.5) (size 2.2 9) (layers "F.Cu" "F.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
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(pad "6" smd rect (at 21.78 -4.5) (size 2.2 9) (layers "F.Cu" "F.Mask")
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(pad "7" smd rect (at 17.82 -4.5) (size 2.2 9) (layers "F.Cu" "F.Mask")
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(pad "10" smd rect (at 5.94 -4.5) (size 2.2 9) (layers "F.Cu" "F.Mask")
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(pad "11" smd rect (at 1.98 -4.5) (size 2.2 9) (layers "F.Cu" "F.Mask")
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(pad "13" smd rect (at -5.94 -4.5) (size 2.2 9) (layers "F.Cu" "F.Mask")
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(pad "14" smd rect (at -9.9 -4.5) (size 2.2 9) (layers "F.Cu" "F.Mask")
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(pad "15" smd rect (at -13.86 -4.5) (size 2.2 9) (layers "F.Cu" "F.Mask")
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(pad "19" smd rect (at -29.7 -4.5) (size 2.2 9) (layers "F.Cu" "F.Mask")
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(pad "20" smd rect (at -33.66 -4.5) (size 2.2 9) (layers "F.Cu" "F.Mask")
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(pad "21" smd rect (at -37.62 -4.5) (size 2.2 9) (layers "F.Cu" "F.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "22" smd rect (at -41.58 -4.5) (size 2.2 9) (layers "F.Cu" "F.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "A" smd rect (at 41.58 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "B" smd rect (at 37.62 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "C" smd rect (at 33.66 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "D" smd rect (at 29.7 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "E" smd rect (at 25.74 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "F" smd rect (at 21.78 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "H" smd rect (at 17.82 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "J" smd rect (at 13.86 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "K" smd rect (at 9.9 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
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(pad "L" smd rect (at 5.94 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
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(pad "M" smd rect (at 1.98 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "N" smd rect (at -1.98 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "P" smd rect (at -5.94 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "R" smd rect (at -9.9 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "S" smd rect (at -13.86 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "T" smd rect (at -17.82 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "U" smd rect (at -21.78 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "V" smd rect (at -25.74 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "W" smd rect (at -29.7 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "X" smd rect (at -33.66 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "Y" smd rect (at -37.62 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
(pad "Z" smd rect (at -41.58 -4.5 180) (size 2.2 9) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 00000000-0000-0000-0000-000000000000))
)